Anti-leakage ACF Bonding Tape For Hot-pressed High Temperature Buffer
Product Description:
BM500 Bonding Silicone Rubber Sheet with silicone as carrier, through adding high performance nano material and heat conduction material made into by thin material flattener. It has excellent thermal conduction performance, excellent heat resistance and surface antistatic property . Completely replace the Shin Etsu HC series, HC-A series, HC-DS series in performance.
BM500 used in various types of display screen hot-press binding technology, put it on the bottom surface of thermal head , have a buffer effect on temperature, so that the temperature is uniform, isolation hot pressed products in direct contact with the thermal head, also has to prevent isolation protective effect of electrostatic leakage.
Feature:
Thermal resistance : -60~200 ºC
low fastening pressure
Surface smooth and highly adapted
Electrical insulation
Product performance parameters table:
| JRF - BM500 PROPERTIES TABLE | ||
| Name/Unit | Numerical | Testing Method |
| Part No. | BM500 | ---- |
| Thickness | 0.1~0.45 | ASTM D347 |
| Color | Black /Green | Visual |
| Thickness tolerance (mm) | 0.06±0.01 | ASTM D347 |
| Continuos use temp (ºC) | -60~200 | TGA +DMA |
| Thermal Conductivity (W/m-k) | 0.6~2.8 | ASTM D5470 |
| Volume Resistivity( Ω-cm) | 10^17 ↑ | ASTM D257 |
| Breakdown Voltage | 1KV↑ | ASTM D149 |
| Hardness (shore A) | 85±5 | ASTM D2240 |
| Specific Gravity | 2 | ASTM D792 |
| Tensile Strength (kg/cm2) | 80 | ASTM D412 |
| Elongation(%) | 2 | ASTM D412 |
Application:
1.ITO conductive glass
2.Electronic, electrical appliances
3.Flexible board (FPC)
4.Insulating thermal conduction semiconductor
5.Thermal conductive film, ACF heat pressing engineering
6.Thermistors and temperature sensors
Certification:
natural organic matter
Thermal conductivity: high temperature: 1600 degrees below the ideal heat insulating material of high voltage and high frequency equipment
Company introduction:
Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd. Was founded in 2010, a total investment of more than 1000000 RMB. Jia RiFeng Tai is a professional committed to the domestic and foreign electronic thermal insulation materials of high-tech enterprises.
Our Main Products: Thermal conductive filler material, like thermal gap pad, insulator silicone sheet, insulator silicone sleeve, ACF conductive film, thermal silicone heating, thermal double-sided tape, thermal graphite, thermal silicone encapsulants, thermal grease / paste, alumina ceramic, Aln ceramic, zirconia ceramic, Sic ceramic, NFC Ferrite sheet, EMI absorber sheet, thermal phase change material, silicone rubber (Fujipoly), Bergquist thermal conductive material K4, K6, K10 insulation gap pad.
Our Advantage:
1.We make and export high quality.
2.We provide the most favorable and most competitive prices for you.
3. We will supply with all information to u ,about package, weight,and so on.
4. We can customize the products for you, such as the size, shape, color and so on
5. We provide the best after-sales service and try our best to solve problems for our customers.
Our services:
We provide free samples for testing, please feel free to contact our sales.
We can offer competitive prices and after sales services.
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